发明名称 WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a wiring board having the inside of through holes opened in an insulating plate filled with plating conductors and a wiring conductor consisting of a plating conductor laid on the top and the back planes of the insulating plate, which includes a wiring conductor in stable thickness on both principal planes of the insulating plate.SOLUTION: A wiring board 10 includes: an insulating plate 1 which has a first principal plane S1 and a second principal plane S2 on the opposite side of the first principal plane S1 and also has a plurality of through holes 7 penetrating between the first principal plane S1 and the second principal plane S2 in tapered form, with the diameter becoming smaller from the first principal plane S1 side toward the second principal plane S2 side; and a wiring conductor 4, deposited by a semi-additive method, which fills up the inside of the through holes 7 and also extends to the first principal plane S1 and the second principal plane S2. The wiring conductor 4 does not include wiring patterns in width of 60 μm or less on the first principal plane S1 and includes solid wiring patterns and wiring patterns in width of 50 μm or less on the second principal plane S2.
申请公布号 JP2013206937(A) 申请公布日期 2013.10.07
申请号 JP20120071384 申请日期 2012.03.27
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 SHIGA YOSHITAKA
分类号 H05K3/42;H05K1/11;H05K3/40 主分类号 H05K3/42
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