| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser trimming method which achieves the prevention of the scattering and readhesion of machining chips of a substrate after the asymmetry of a section of the substrate is corrected by performing laser trimming on a surface of the substrate.SOLUTION: A substrate having semipermeability is used so that it becomes possible to irradiate an internal part of the substrate with a laser beam 6. Only the asymmetry of a section of the substrate can be corrected without being associated with a mass change thanks to the internal processing. No machining chips are created during the laser trimming so that the readhesion of the machining chips is prevented. |
