SPUTTERING DEVICE FOR LEAD FRAME MATERIAL FOR MOUNTING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING LEAD FRAME MATERIAL FOR MOUNTING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a sputtering device for a lead frame material for mounting a semiconductor light-emitting element and a method for manufacturing the lead frame material for mounting the semiconductor light-emitting element, capable of performing high speed manufacturing of the long lead frame material for mounting the semiconductor light-emitting element.SOLUTION: A sputtering device for a lead frame material for mounting a semiconductor light-emitting element includes: a vacuum chamber 2; a feeding roll 5, disposed inside the vacuum chamber 2, for feeding a base material 4a for a long lead frame material for mounting a semiconductor light-emitting element; a planar magnetron cathode electrode 7 for forming the lead frame material 4 for mounting a semiconductor light-emitting element by forming a film in at least a part of the surface of the base material 4a; and a winding roll 6 winding up the lead frame material 4 for mounting a semiconductor light-emitting element. The planar magnetron cathode electrode 7 having a rectangular shape is disposed to face the base material 4a conveyed between the feeding roll 5 and the winding roll 6, and is disposed so that its long-side direction agrees with the conveying direction of the base material 4a.