| 摘要 |
PROBLEM TO BE SOLVED: To reduce variations in phosphor layer thickness and light distribution characteristic in an LED light-emitting device formed by dropping resin mold.SOLUTION: An LED bare chip is disposed on a wiring board and a lamination sheet mask having a light emission aperture opened therein is laid on top of the wiring board. The lamination sheet mask has a light emission aperture and a cut-out hole around it formed therein. Resin dam is formed by printing through the cut-out hole and, after an upper sheet mask of the lamination sheet mask is removed, a phosphor layer is formed by applying a coating of it through the light emission aperture. Thereafter, the remaining sheet mask is removed, and resin mold is dropped from above to form a resin mold layer while taking care not to let it spread to the outside of the resin dam. |
