| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in sensitivity, resolution, solder heat resistance, gold plating resistance, and HAST resistance, and whose solder resist surface is matte.SOLUTION: A photosensitive resin composition contains (A) component: a compound obtained by reacting at least an epoxy resin and (meth)acrylic acid, (B) component: a polymerizable compound having ethylenic unsaturated linkage, (C) component: urethane beads, and (D) component: photopolymerization initiator. |
