发明名称 ELECTRONIC APPARATUS AND ELECTRONIC APPARATUS HOUSING APPLIED TO THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain an electronic apparatus which has a body made of a resin and an insertion hole of a binding band that is integrally molded on a bottom plate of the body and facilitates fixing work of an electric wire group, and to obtain an electronic apparatus housing applied to the electronic apparatus.SOLUTION: In an electronic apparatus housing 1, a binding band fixing part 10 is integrally molded with a bottom plate 3 of a resin body 2 and an installation surface of a rear surface of the bottom plate 3 is disposed contacting with a wall. The binding band fixing part 10 includes: a first opening 11 opening on a surface of the bottom plate 3; a second opening 12 that opens on the surface of the bottom plate 3 being separated from the first opening 11; a third opening 13 that opens on the rear surface of the bottom plate 3 between the first opening 11 and the second opening 12; a communication passage 14 allowing the first opening 11, the third opening 13, and the second opening 12 to communicate with each other; and a bridge part 15 that is disposed between the first opening 11 and the second opening 12 opposing the third opening 13 in the communication passage 14. A periphery of the third opening 13 on the rear surface of the bottom plate 3 is flush with the installation surface of the bottom plate 3.
申请公布号 JP2013207144(A) 申请公布日期 2013.10.07
申请号 JP20120075854 申请日期 2012.03.29
申请人 NOHMI BOSAI LTD 发明人 YASAKU AKIHIRO;NAGATA TOMOKAZU
分类号 H05K7/00 主分类号 H05K7/00
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