发明名称 METHOD AND APPARATUS FOR INSPECTING SUBSTRATES
摘要 PROBLEM TO BE SOLVED: To shorten time required for a substrate inspection.SOLUTION: In an acceleration zone and a deceleration zone of a substrate or light receiving means that relatively moves, a moving velocity is lower than that in a constant velocity zone, an inspected spatial resolution of the light receiving means is reduced in a moving direction, a difference occurs between resolution of the constant velocity zone and resolution of the acceleration zone and the deceleration zone, and an inspected defect shape generates a gap between dimensions. In this invention, a shutter speed of light receiving means is corrected during acceleration and deceleration so that resolution of the light receiving means in the acceleration zone and the deceleration zone is almost equal to the resolution of the light receiving means in the constant velocity zone. Further, the sensing capability of light receiving means is corrected during acceleration and deceleration so that the sensing capability of the light receiving means in the acceleration zone and the deceleration zone is almost equal to the sensing capability of the light receiving means in the constant velocity zone.
申请公布号 JP2013205039(A) 申请公布日期 2013.10.07
申请号 JP20120070849 申请日期 2012.03.27
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 IWAI SUSUMU;MURAMATSU GO
分类号 G01N21/896;G01N21/958 主分类号 G01N21/896
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