| 摘要 |
PURPOSE: A wafer processing tape is provided to prevent a pick-up fault by using a thermoplastic bridge resin having a thermal conductivity of 0.15W/mK or greater. CONSTITUTION: One adhesive layer(12) is formed on a base film(11). The other adhesive layer(13) is formed on the one adhesive layer. A base film is made of a thermoplastic bridge resin. The thermal conductivity of the thermoplastic bridge resin is 15W/mK or greater. A wafer processing tape(10) includes a base film and two adhesive layers. |
