| 摘要 |
<p>Disclosed is a method for manufacturing a built-up substrate wherein an insulating layer and a wiring pattern layer are laminated on a circuit board. The method includes (i) a step wherein a photoreactive metal oxide precursor raw material is applied to both of or one of the surfaces of the circuit board that is provided with the wiring pattern, the photoreactive metal oxide precursor raw material is dried, and an insulating film is formed, (ii) a step wherein an opening for a via hole is formed in the insulating film by exposing and developing the insulating film, (iii) a step wherein the insulating film is changed into an inorganic metal oxide film by heat-treating the insulating film, thereby obtaining a built-up insulating layer configured of the inorganic metal oxide film, and (iv) a step wherein the via hole is formed, and at the same time, a metal layer is formed, by plating the built-up insulating layer, and a built-up wiring pattern is formed by etching the metal layer, and in the method, (v) the steps (i-iv) are repeated one or more times.</p> |
