METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE WAFER DIRECTLY EMITTING WHITE LIGHT

摘要

Provided is a method for manufacturing a light-emitting diode wafer directly emitting white light, comprising: manufacturing electric connection metal bumps on a chip bonding pad of a light-emitting diode wafer, attaching a flat plate clamping device to the bumps, forming a gap between the wafer and the flat plate clamping device and ensuring that the height of the gap is uniform, filling the gap with a mixture of fluorescent powder and epoxy resin or fluorescent powder and silicone, heating and curing same, stripping the flat plate clamping device, and cutting the light-emitting diode wafer into single white-light light-emitting diodes. The method realizes a large-scale LED chip package on a wafer and can keep the thickness of the fluorescent powder layer uniform, and improves the package efficiency and yield of the LED which directly emits white light, and the white-light LED chip has good spatial color uniformity and overall color temperature uniformity.