| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing wiring boards which provides a greater number of the wiring boards when multiple wiring boards are formed and has high manufacturing efficiency.SOLUTION: A method for manufacturing wiring boards 20 includes the steps of arranging two support substrates 7, each of which has a region X for product formation and a margin region Y and a principle surface A for product formation on one side and a principle surface B for separation on the other side, such that the principle surfaces B are opposed to each other, forming bases 12 for wiring substrate formation such that the margin regions Y are bonded to each other with two separation films 8 held between the regions X, forming laminates 13 for wiring substrate on the principle surfaces A including the regions X, then cutting the bases 12 and the laminates 13 at a boundary between the region X and the margin region Y, and separating the separation films 8 from each other on the region X. The separation films 8 protrude into the margin region Y and have a number of openings 11 at a part of the protrusion. The regions Y on the support substrates 7 are bonded to each other through the openings 11. |
