发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which one-chip IGBT and a diode have good properties.SOLUTION: A semiconductor device according to an embodiment comprises: an IGBT cell and a diode cell which are formed on one semiconductor substrate of a first conductivity type; a first semiconductor layer of a second conductivity type which is formed in the IGBT cell region of a surface layer part of the semiconductor substrate on a lower surface side; a second semiconductor layer of a first conductivity type which is formed in a region next to the IGBT cell region of a surface layer part of the semiconductor substrate on the lower surface side; gate electrodes which are formed on a surface layer part of the semiconductor substrate on an upper surface side leaving a predetermined interval between the gate electrodes; a third semiconductor layer of the first conductivity type and a fourth semiconductor layer of the second conductivity type which are formed between the gate electrodes; a fifth semiconductor layer of the first conductivity type which is formed in the IGBT cell region above the first semiconductor layer; a first electrode formed on the third semiconductor layer and the fourth semiconductor layer; and a second electrode formed on the semiconductor substrate on the lower surface side. |
申请公布号 |
JP2013201360(A) |
申请公布日期 |
2013.10.03 |
申请号 |
JP20120069800 |
申请日期 |
2012.03.26 |
申请人 |
TOSHIBA CORP |
发明人 |
OGURA TSUNEO;SUESHIRO TOMOKO;OSHINO YUICHI;NINOMIYA HIDEAKI |
分类号 |
H01L29/739;H01L21/336;H01L27/04;H01L29/12;H01L29/78 |
主分类号 |
H01L29/739 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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