发明名称 |
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE |
摘要 |
An electrode body is provided as an electrode body capable of appropriately reducing a load when silicon wafer direct bonding is performed. The electrode body includes a base member that has a predetermined thickness; and an electrode portion that is formed on one surface of the base member in a thickness direction thereof. The electrode portion includes a basic bump formed in a substantially columnar shape to protrude on the base member and a fragile bump formed independently from the basic bump to form a metallic bond with the basic bump.
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申请公布号 |
US2013256880(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201313851468 |
申请日期 |
2013.03.27 |
申请人 |
OLYMPUS CORPORATION |
发明人 |
MIGITA CHIHIRO;KIKUCHI HIROSHI;TAKEMOTO YOSHIAKI |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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