发明名称 |
Stacked Semiconductor Package |
摘要 |
A method of making a stacked semiconductor package having at least a leadframe, a first die mounted above and soldered to the lead frame and a first clip mounted above and soldered to the first die. The method includes positioning the leadframe, first die and first clip in a vertically stacked relationship and nonsolderingly locking the first clip in laterally nondisplaceble relationship with the leadframe. A stacked semiconductor package and an intermediate product produced in making a stacked semiconductor package are also disclosed.
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申请公布号 |
US2013256852(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213431758 |
申请日期 |
2012.03.27 |
申请人 |
WYANT MICHAEL TODD;CONDE PATRICIA SABRAN;GUPTA VIKAS;DUNNE RAJIV;ENIPIN EMERSON MAMARIL;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
WYANT MICHAEL TODD;CONDE PATRICIA SABRAN;GUPTA VIKAS;DUNNE RAJIV;ENIPIN EMERSON MAMARIL |
分类号 |
H01L25/07;H01L21/50;H01L23/495 |
主分类号 |
H01L25/07 |
代理机构 |
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