ELASTIC WAVE APPARATUS AND METHOD FOR MANUFACTURING SAME

摘要

Provided is an elastic wave apparatus in which heat dissipation can be effectively increased. This elastic wave apparatus (1) comprises: elastic wave elements (5-7), to each of which is provided an electrode (14) so as to contact a piezoelectric layer (13), the piezoelectric layer (13) being directly or indirectly supported by a supporting substrate (11); and a highly thermally-conductive member (23) laminated on a surface opposite the surface of the supporting substrate (11) supporting the piezoelectric layer (13); wherein the thermal conductivity of the supporting substrate (11) is higher than the thermal conductivity of the piezoelectric layer (13); the linear expansion coefficient of the supporting substrate (11) is lower than the linear expansion coefficient of the piezoelectric layer (13); and the surface area of the highly thermally-conductive member (23) is larger than the surface of the supporting substrate (11) supporting the piezoelectric layer (13) and has a higher thermal conductivity than the piezoelectric layer (13).