发明名称 Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices
摘要 Microelectromechanical systems (MEMS) packages, packaged MEMS devices, and methods for making the same are disclosed. The method may include forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer. The method further may include forming a packaging layer above the chamber sacrificial layer. The method additionally may include forming one or more openings through the packaging layer. The method also may include removing the chamber sacrificial layer through the one or more openings. The method may include forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity.
申请公布号 US2013260503(A1) 申请公布日期 2013.10.03
申请号 US201313903363 申请日期 2013.05.28
申请人 THE BOARD OF REGENTS OF THE UNIVERSITY OF TEXAS SYSTEM 发明人 BUTLER DONALD P.;CELIK-BUTLER ZEYNEP;CHITTEBOYINA MURALI M.;RAHMAN MOHAMMAD S.
分类号 B81C1/00 主分类号 B81C1/00
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