发明名称 |
METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE |
摘要 |
A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.
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申请公布号 |
US2013255079(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201013878864 |
申请日期 |
2010.10.14 |
申请人 |
MAIJALA JUHA;SIRVIOE PETRI;STORA ENSO OYJ |
发明人 |
MAIJALA JUHA;SIRVIOE PETRI |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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