发明名称 POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING LIQUID
摘要 Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of -COOM group, -Ph-OM group, -SO3M group and -PO3M2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.
申请公布号 US2013260558(A1) 申请公布日期 2013.10.03
申请号 US201113884883 申请日期 2011.12.22
申请人 OOTA MUNEHIRO;TANAKA TAKAAKI;TAKIZAWA TOSHIO;YOSHIKAWA SHIGERU;MATSUMOTO TAKAAKI;YOSHIKAWA TAKAHIRO;SHINODA TAKASHI;HITACHI CHEMICAL CO., LTD. 发明人 OOTA MUNEHIRO;TANAKA TAKAAKI;TAKIZAWA TOSHIO;YOSHIKAWA SHIGERU;MATSUMOTO TAKAAKI;YOSHIKAWA TAKAHIRO;SHINODA TAKASHI
分类号 H01L21/306 主分类号 H01L21/306
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