| 摘要 |
The present disclosure relates to the field of fabricating microelectronic packages and devices, wherein a microelectronic package may be formed with an interposer with at least one microelectronic component attached to an active surface of the interposer, and at least one coaxial connector attached to an opposing attachment surface of the interposer. The microelectronic package may be attached to a substrate to form the microelectronic device, wherein the substrate includes an opening therethrough for access to the at least one coaxial connector. |
