SUPERSPEED INTER-CHIP COMMUNICATIONS,申请号WO2013US34613-传众专利搜索

发明名称	SUPERSPEED INTER-CHIP COMMUNICATIONS
摘要	An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB3.0 system interface and an M-PHY interface.
申请公布号	WO2013149146(A1)	申请公布日期	2013.10.03
申请号	WO2013US34613	申请日期	2013.03.29
申请人	INTEL CORPORATION;RANGANATHAN, SRIDHARAN;HARRIMAN, DAVID J.;MUKKER, ANOOP;CHELLAPPAN, SATHEESH;VADIVELU, KARTHI R.;SHARMA, SHALINI;SARWAR, ZEESHAN	发明人	RANGANATHAN, SRIDHARAN;HARRIMAN, DAVID J.;MUKKER, ANOOP;CHELLAPPAN, SATHEESH;VADIVELU, KARTHI R.;SHARMA, SHALINI;SARWAR, ZEESHAN
分类号	H04L29/10	主分类号	H04L29/10
代理机构		代理人
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