发明名称 |
SUBSTRATE SUPPORT WITH RADIO FREQUENCY (RF) RETURN PATH |
摘要 |
<p>Apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing a substrate includes a substrate support that may include a dielectric member having a surface to support a substrate thereon; one or more first conductive members disposed below the dielectric member and having a dielectric member facing surface adjacent to the dielectric member; and a second conductive member disposed about and contacting the one or more first conductive members such that RF energy provided to the substrate by an RF source returns to the RF source by traveling radially outward from the substrate support along the dielectric member facing surface of the one or more first conductive members and along a first surface of the second conductive member disposed substantially parallel to a peripheral edge surface of the one or more first conductive members after travelling along the dielectric layer facing surface.</p> |
申请公布号 |
WO2013148564(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
WO2013US33686 |
申请日期 |
2013.03.25 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
RITCHIE, ALAN;YOUNG, DONNY;WANG, WEI W.;JUPUDI, ANANTHKRISHNA;NGUYEN, THANH X.;SAVANDAIAH, KIRANKUMAR |
分类号 |
H01L21/683;C23C14/50;H01L21/205 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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