| 摘要 |
PROBLEM TO BE SOLVED: To provide a vibration device which inhibits the damage due to heat expansion caused by changes of the temperature etc.SOLUTION: A vibration device includes: a semiconductor element; a first electrode and a second electrode which are positioned on a first surface of the semiconductor element; a vibration element; a third electrode and a fourth electrode which are positioned on a first surface of the vibration element; a first connection part connecting the first electrode with the third electrode; and a second connection part connecting the second electrode with the fourth electrode. A heat expansion coefficient of the semiconductor element is different from a heat expansion coefficient of the vibration element. The vibration element has a coupling part positioned between the third electrode and the fourth electrode. The coupling part includes at least one bending part positioned between the third electrode and the fourth electrode. |
