发明名称 SUBSTRATE OF LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREFOR, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for optical semiconductor device having an extremely excellent reflectance from the near-ultraviolet range to the visible light range (wavelength 340-800 nm), in a lead frame for optical semiconductor device used for an LED, a photocoupler, a photo-interrupter, and the like, and to provide a lead frame using the substrate, and a manufacturing method therefor.SOLUTION: In the lead frame for optical semiconductor device provided, on the surface of a substrate 1 for lead frame, with a reflective layer 2 consisting of a silver or silver alloy film having a thickness of 3 μm or less, preferably, and formed by rolling, the glossiness on the surface of the substrate, measured at an incident angle of 60° conforming to JISZ8741 is 500% or more in a direction parallel with the rolling direction and a direction perpendicular thereto, and the ratio of glossiness in the parallel direction and perpendicular direction is 0.8-1.2.
申请公布号 JP2013201399(A) 申请公布日期 2013.10.03
申请号 JP20120070388 申请日期 2012.03.26
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOBAYASHI YOSHIAKI;ZAMA SATORU;MATSUDA AKIRA;SUZUKI SATOSHI
分类号 H01L33/62 主分类号 H01L33/62
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