POWER MODULE MANUFACTURING METHOD AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a power module manufacturing method and a power module, which uses a lead-free bonding technology supporting good radiation performance and good bondability at a substrate bonded part at the same time.SOLUTION: A semiconductor module manufacturing method comprises: bonding semiconductor elements 1 and 2 to a ceramic substrate 5 having solid Cu wires by sintered Ag paste 4 so as to make a porosity of a porous Ag layer be not less than 5% and less than 30%; and subsequently, performing hydrogen reduction and bonding the ceramic substrate 5 to a base 10 by an Sn-based solder 9 having a solidus temperature of 227°C and over.