POWER SEMICONDUCTOR MODULE

摘要

The present invention addresses the problem of enhancing the reliability of a power semiconductor module having excellent cooling performance. The power semiconductor module of the present invention for solving this problem is characterized by having a can-shaped cooling case configured from a leaf spring part for generating a compressive stress on a semiconductor circuit part, an adjusting part for deforming so as to adjust the amount of elastic deformation of the leaf spring part, and a side wall part whereby the leaf spring part and the adjusting part are connected.