SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

The present invention provides a method for manufacturing a semiconductor package comprising connecting wiring which is precise and has a low defect rate in the manufacturing process. The method for manufacturing the semiconductor package, according to one embodiment of the present invention, comprises the steps of: preparing a conductive member; removing one portion of the conductive member to form a flat portion and a protruding portion, which protrudes from the flat portion; arranging the conductive member and a semiconductor chip, and forming a sealing member for sealing a semiconductor chip and the conductive member; exposing the protruding portion of the conductive member through the sealing member to form the connecting wiring; forming a rewiring pattern layer which electrically connects the connecting wiring and the semiconductor chip; and forming an external connection member which is electrically connected to the rewiring pattern layer.