发明名称 |
METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURED VIA THE SAME |
摘要 |
Disclosed herein are a method of manufacturing a multilayer printed circuit board (PCB), a via which is an inner via hole (IVH) having a stable structure so as to easily form a fine pattern, thereby thinning a product, and a multilayer PCB manufactured via the same. The method includes preparing a base substrate including copper foils formed on opposite surfaces or a single surface of the base substrate; forming an insulating layer on the base substrate via a coating process; processing a via hole through the insulating layer formed on the base substrate up to the base substrate; performing fill plating on the via hole; and stacking at least one circuit layer on a metal layer that is formed via the fill plating.
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申请公布号 |
US2013256010(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201313793618 |
申请日期 |
2013.03.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JUNG JAE YOUB;LEE YANG JE |
分类号 |
H05K3/46;H05K1/09;H05K1/11 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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