| 摘要 |
An apparatus for cutting micro-grids from a metal substrate is provided. The apparatus includes a support and a cutting module. The support includes a supporting surface, the support is configured to support a micro-grid and the metal substrate. The cutting module includes a fixing element, a spring and a cutting structure. The fixing structure and the spring are located in the cutting structure. The fixing element is configured to fix the micro-grid on the supporting surface. The cutting structure is configured to cut the micro-grid from the metal substrate.
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