COPPER-CLAD LAMINATE HAVING PRIMER LAYER AND WIRING BOARD USING SAME

摘要

The purpose of the present invention is to provide a copper-clad laminate which has good adhesion between a copper foil and a polyimide resin that serves as the base resin, while having rust prevention effect for the copper foil. The present invention relates to a copper-clad laminate that comprises: a primer resin (B) layer which is formed of a solvent-soluble polyimide and provided on the surface of a coating layer that is provided on a copper foil (A) which has not been subjected to a roughening treatment; and a polyimide layer (D) that is directly bonded onto the primer resin (B) layer. The copper-clad laminate satisfies the conditions (1)-(4) described below. The present invention also relates to a wiring board which uses the copper-clad laminate. (1) The coating layer is configured of an Ni layer and a Cr layer that are sequentially laminated from the copper foil surface. (2) The coating amount of Ni and the coating amount of Cr in the coating layer are respectively 15-440 mug/dm2 and 15-210 mug/dm2. (3) The maximum thickness of the coating layer is 0.5-5 nm, and the minimum thickness of the coating layer is 80% or more of the maximum thickness. (4) The solvent-soluble polyimide is a specific ring-closed polyimide resin.