发明名称 |
LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR PACKAGES |
摘要 |
A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.
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申请公布号 |
US2013260511(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213494814 |
申请日期 |
2012.06.12 |
申请人 |
CHEN CHIN-LIANG;LIN WEI-TING;LIU YU-CHIH;HO KUAN-LIN;SHEN JASON;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN CHIN-LIANG;LIN WEI-TING;LIU YU-CHIH;HO KUAN-LIN;SHEN JASON |
分类号 |
H01L21/52;B05C1/00 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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