发明名称 CONTINUOUS PROCESSING SYSTEM, CONTINUOUS PROCESSING METHOD, AND PROGRAM
摘要 In a continuous processing system, a controller of a heat treatment apparatus calculates a weight of each layer from input target film thicknesses of a phosphorous-doped polysilicon film (D-poly film) and an amorphous silicon film (a-Si film), and calculates activation energy of stacked films based on the calculated weight and activation energy. The controller prepares a stacked film model based on the calculated activation energy and a relationship of a temperature of each zone and film thicknesses of the D-poly film and the a-Si film, and calculates an optimum temperature of each zone by using the prepared stacked film model. The controller controls power controllers of heaters to set a temperature in a reaction tube to be the calculated temperature of each zone and forms stacked films on a semiconductor wafer by controlling a pressure adjusting unit, flow rate adjusting units, etc.
申请公布号 US2013260572(A1) 申请公布日期 2013.10.03
申请号 US201313804036 申请日期 2013.03.14
申请人 TOKYO ELECTRON LIMITED 发明人 TAKENAGA YUICHI;TOJO YUKIO
分类号 H01L21/31;H01L21/02 主分类号 H01L21/31
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