发明名称 METHODS OF FORMING CAPACITORS AND SEMICONDUCTOR DEVICES INCLUDING A RUTILE TITANIUM DIOXIDE MATERIAL
摘要 Methods of forming a capacitor including forming at least one aperture in a support material, forming a titanium nitride material within the at least one aperture, forming a ruthenium material within the at least one aperture over the titanium nitride material, and forming a first conductive material over the ruthenium material within the at least one aperture. The support material may then be removed and the titanium nitride material may be oxidized to form a titanium dioxide material. A second conductive material may then be formed over an outer surface of the titanium dioxide material.
申请公布号 US2013260529(A1) 申请公布日期 2013.10.03
申请号 US201313903267 申请日期 2013.05.28
申请人 MICRON TECHNOLOGY, INC. 发明人 HUANG TSAI-YU;BHAT VISHWANATH;ANTONOV VASSIL;HSIEH CHUN-I;CARLSON CHRIS
分类号 H01L49/02 主分类号 H01L49/02
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