发明名称 HEAT TRANSFER COMPONENT AND HET TRANSFER PROCESS
摘要 A heat transfer component and heat transfer process are disclosed. The heat transfer component includes thermally-responsive features positioned along a surface of the heat transfer component. The thermally-responsive features deploy from or retract toward the surface in response to a predetermined temperature change. The deploying from or the retracting toward of the thermally-responsive features increases or decreases a rate of heat transfer between a flow along the surface and the surface. The heat transfer process includes providing a heat transfer component having thermally-responsive features positioned along a surface of the heat transfer component; and increasing or decreasing a heat transfer rate between the surface and a flow by deploying the thermally-responsive features from or the retracting the thermally-responsive features toward the surface in response to a predetermined temperature change.
申请公布号 US2013255931(A1) 申请公布日期 2013.10.03
申请号 US201213690376 申请日期 2012.11.30
申请人 GENERAL ELECTRIC COMPANY 发明人 ARNETT MICHAEL DOUGLAS;HEFNER REBECCA EVELYN
分类号 F28F27/00 主分类号 F28F27/00
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