发明名称 |
Monolithic Power Converter Package with Through Substrate Vias |
摘要 |
According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. The high side power input and a power output of the half-bridge each are disposed on a top surface of the monolithic die. The high side power input is electrically coupled to the substrate through a high side power connection. The power output is electrically coupled to the substrate through a power output connection. The low side power input of the half-bridge comprises a plurality of through substrate vias that extend through the monolithic die to electrically connect a low side power pad to the monolithic die.
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申请公布号 |
US2013256905(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213656461 |
申请日期 |
2012.10.19 |
申请人 |
CHO EUNG SAN;FERNANDO DEAN;PHILIPS TIM;CLAVETTE DAN;INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
CHO EUNG SAN;FERNANDO DEAN;PHILIPS TIM;CLAVETTE DAN |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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