LED PACKAGE AND MANUFACTURING METHOD FOR SAME

摘要

An LED chip (12) is mounted on the surface (inner surface) on the reverse side from the light-extraction side of a light-transmitting case (11). The surface of the LED chip (12) that is on the reverse side from the surface on which an electrode (14) was formed is joined to the inner surface of the light-transmitting case (11) by an adhesive or the like. Subsequently, the electrode (14) of the LED chip (12) is connected to an electrode on a lead frame (13) with a bonding wire (15) or the like. This configuration is a structure in which the LED chip (12) is mounted on the light-transmitting case (11), and thus it is possible to manufacture the light-transmitting case (11) before the LED chip (12) is mounted. As a result, it becomes unnecessary to consider the connection reliability, heat resistance, and the like of the LED chip (12) or the light-transmitting case (11) on which the LED chip (12) is mounted when manufacturing the light-transmitting case (11), and it is possible to form the light-transmitting case (11) using materials (for example, glass) exhibiting excellent optical properties (transparency, etc.), weather resistance, heat resistance, and the like.