| 摘要 |
<p>This surface-treated copper foil is characterized in that, in an XPS survey measurement of the copper foil surface, the Si concentration is 2.0% or greater and the N concentration is 2.0% or greater. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed circuit board (FPC), in which a copper foil is layered on a liquid crystal polymer (LCP) suitable for high-frequency applications.</p> |
