| 摘要 |
PROBLEM TO BE SOLVED: To suppress a coating layer of a palladium coated copper bonding wire from dropping off from its core material and to provide a bonding wire with a surface on which no copper exposure occurs.SOLUTION: A method for manufacturing a palladium coated copper bonding wire manufactured by forming in a plating step a palladium coated layer around a core material 10 whose main component is copper, comprises: a single wire drawing step P2 in which, before the plating step, the core material is single wire drawn; and a heat treatment step P3 for heat treating the core material thus single wire drawn. The heat treatment step is a batch type heat treatment step in nitrogen atmosphere. In the step the core material after being single wire drawn is placed for a prescribed amount in a heating oven 40 and sealed therein, then the heating oven is filled with nitrogen gas and heating inside the heating oven is started. |
