COPPER FOIL WITH CARRIER, METHOD OF MANUFACTURING THE SAME, COPPER FOIL WITH CARRIER FOR PRINTED WIRING BOARD, AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To develop a copper foil for semiconductor package board that can avoid circuit erosion phenomenon without degrading other characteristics of a copper foil, and especially to provide a copper foil for printed circuit board that can enhance adhesive strength between the copper foil and resin by improving a roughening step of a copper foil, as well as a manufacturing method thereof.SOLUTION: A copper foil for printed circuit board includes a roughening layer of a copper foil on at least one surface thereof of which average diameter D1 of particle root at a position of 10% of particle length is 0.2-1.0 μm and a ratio L1/D1 of a particle length L1 to the average diameter D1 of the particle root is 15 or less. After stacking a copper foil for a printed circuit board including the roughening layer and resin, the total area occupied by holes on a resin roughened surface having unevenness is 20% or more on the surface of the resin wherein a copper layer is removed by etching.