发明名称 Cu SHEET TREATMENT METHOD AND Cu SHEET
摘要 PROBLEM TO BE SOLVED: To reduce a stress relaxation rate while making the best use of material characteristics of a Cu sheet.SOLUTION: There is provided a Cu sheet treatment method including an embedding process in which a particulate functional material is supplied onto a surface of a sheet substrate made of Cu or Cu-based alloy, the surface of the sheet substrate is melted by applying laser beams toward the surface of the sheet substrate supplied with the particulate functional material to thereby form a melted part, and then melted part is solidified while the particulate functional material is settled in the melted part, and thus the particulate functional material is directly buried into a prescribed portion of the sheet substrate. The Cu sheet 10 subjected to the treatment includes: the sheet substrate 12 composed of a base material made of Cu or Cu-based alloy; a solidified part 16 which is formed on the prescribed portion of the surface of the sheet substrate 12 and is structure in which the base material is melted and solidified; and an embedding part 18 provided with the particulate functional material 20 directly buried into the solidified part 16.
申请公布号 JP2013199665(A) 申请公布日期 2013.10.03
申请号 JP20120067045 申请日期 2012.03.23
申请人 NGK INSULATORS LTD;TECHNOCOAT CO LTD 发明人 MURAMATSU NAOKUNI;TAKEUCHI RYOTA;AOSHIMA MATSUHISA
分类号 C22C1/10;C22C9/00;C22C19/07;C22F1/00;C23C26/00 主分类号 C22C1/10
代理机构 代理人
主权项
地址