发明名称 |
Cu SHEET TREATMENT METHOD AND Cu SHEET |
摘要 |
PROBLEM TO BE SOLVED: To reduce a stress relaxation rate while making the best use of material characteristics of a Cu sheet.SOLUTION: There is provided a Cu sheet treatment method including an embedding process in which a particulate functional material is supplied onto a surface of a sheet substrate made of Cu or Cu-based alloy, the surface of the sheet substrate is melted by applying laser beams toward the surface of the sheet substrate supplied with the particulate functional material to thereby form a melted part, and then melted part is solidified while the particulate functional material is settled in the melted part, and thus the particulate functional material is directly buried into a prescribed portion of the sheet substrate. The Cu sheet 10 subjected to the treatment includes: the sheet substrate 12 composed of a base material made of Cu or Cu-based alloy; a solidified part 16 which is formed on the prescribed portion of the surface of the sheet substrate 12 and is structure in which the base material is melted and solidified; and an embedding part 18 provided with the particulate functional material 20 directly buried into the solidified part 16. |
申请公布号 |
JP2013199665(A) |
申请公布日期 |
2013.10.03 |
申请号 |
JP20120067045 |
申请日期 |
2012.03.23 |
申请人 |
NGK INSULATORS LTD;TECHNOCOAT CO LTD |
发明人 |
MURAMATSU NAOKUNI;TAKEUCHI RYOTA;AOSHIMA MATSUHISA |
分类号 |
C22C1/10;C22C9/00;C22C19/07;C22F1/00;C23C26/00 |
主分类号 |
C22C1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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