发明名称 BEAM CONDITION MONITORING DEVICE, BEAM CONDITION MONITORING METHOD AND PATTERN MEASURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a beam condition monitoring device and a beam condition monitoring method capable of monitoring a beam condition highly accurately with a simple configuration or a method, and a pattern measuring method using the beam condition monitoring method.SOLUTION: A beam condition monitoring device of an embodiment includes a stage, detection means and monitoring means. The stage supports a substrate where a periodic structure pattern is formed, and controls a position of the substrate. The detection means detects an electromagnetic wave that transmits the substrate or reflects at the substrate, and outputs it as a diffraction intensity signal. The monitoring means acquires the signal a plurality of times while moving the substrate at arbitrary intervals between the electromagnetic wave irradiation means and the detection means by controlling the stage and electromagnetic wave irradiation means, analyzes the fluctuation in the diffraction intensity in association with the position of the substrate, and thereby monitors the beam condition of the electromagnetic wave.
申请公布号 JP2013200181(A) 申请公布日期 2013.10.03
申请号 JP20120068036 申请日期 2012.03.23
申请人 TOSHIBA CORP 发明人 ISHIBASHI YASUHIKO
分类号 G01T1/29 主分类号 G01T1/29
代理机构 代理人
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