Support Device for a Semiconductor Chip and Optoelectronic Component with a Carrier Device and Electronic Component with a Carrier Device

摘要

A carrier device for a semiconductor chip includes a bondable and/or solderable metallic carrier having a mounting region for the semiconductor chip and a soldering region. The carrier is at least partly covered with a covering material. A solder barrier is arranged between the soldering region and the mounting region at an interface between the carrier and the covering material. An electronic component and an optoelectronic component are furthermore specified.