发明名称 |
SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS |
摘要 |
Methods and apparatus to inhibit cracks and delaminations in a semiconductor chip solder bump and to reduce pad parasitic capacitance are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first insulating layer over plural conductor pads of a semiconductor chip and forming an opening over each of the conductor pads. An individual solder structure is coupled to the insulating layer. The solder structure has a projection in each of the openings and in electrical contact with one of the plural conductor pads.
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申请公布号 |
US2013256871(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213434327 |
申请日期 |
2012.03.29 |
申请人 |
TOPACIO RODEN R.;MCLELLAN NEIL |
发明人 |
TOPACIO RODEN R.;MCLELLAN NEIL |
分类号 |
H01L23/498;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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