| 摘要 |
A manufacturing process for manufacturing a layered structure is provided. In the manufacturing process, transfer layers including conductive layers are transferred from transfer films so as to form a first transfer layer defining a first conductive pattern and a second transfer layer defining a second conductive pattern on a surface of a substrate, such that the first conductive layer and the second conductive layer are stacked onto each other. At least one of the first transfer layer and the second transfer layer has a non-conductive layer on a surface facing the other of the first transfer layer and the second transfer layer. The non-conductive layer is provided between the first conductive pattern and the second conductive pattern.
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