发明名称 WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of suppressing size increase of a terminal, while preventing a conductive adhesive agent from leaking out, and enhancing connection reliability.SOLUTION: A suspension substrate 3 with a circuit includes: power source wiring 25B; and a piezoelectric side terminal 40 continuously formed with the power source wiring 25B and electrically connected to a piezoelectric element 5 at a lower side. The piezoelectric side terminal 40 includes: an outer contact part 51; and an inner contact part 53 formed in the periphery of the outer contact part 51 and projecting further downward in comparison with the outer contact part 51.
申请公布号 JP2013200909(A) 申请公布日期 2013.10.03
申请号 JP20120067717 申请日期 2012.03.23
申请人 NITTO DENKO CORP 发明人 ISHIGAKI SAORI;KANEKAWA HITONORI;FUJIMURA HIROTO
分类号 G11B5/60;G11B21/10;G11B21/21;H05K1/05 主分类号 G11B5/60
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