| 摘要 |
PROBLEM TO BE SOLVED: To provide a heater cleaning method capable of cleaning a heater well.SOLUTION: A substrate processing device includes a wafer rotation mechanism 3 which holds a wafer W and rotates it, and a heater head 35 which is arranged to face a surface of the wafer W held by the wafer rotation mechanism 3, for heating SPM liquid on the surface of the wafer W. At an upper end of a spin shaft 7 of the wafer rotation mechanism 3, a rear surface nozzle 82 is disposed. The upper end of the rear surface nozzle 82 has a rear surface liquid discharge opening 84 formed. The heater head is disposed at a position facing above the rear surface liquid discharge opening 84, and the rear surface nozzle 82 is supplied with cleaning liquid and the cleaning liquid is discharged upward from the rear surface liquid discharge opening 84. Thus, an outside surface of a housing of a heater is well cleaned, thus the outside surface of the housing is kept in a clean state. |
