发明名称 |
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, which can inhibit mold flash well and improve productivity of the semiconductor device.SOLUTION: An adhesive sheet 10 for manufacturing a semiconductor device includes a base material and a thermosetting adhesive layer provided on one surface of the base material, and is detachably attached to a lead frame 20 or a wiring board of the semiconductor device. The adhesive layer has an adhesive strength a before heating which is measured by a specific peel test A is 0.07 N/20 mm and more; an adhesive strength b after heating which is measured by a specific peel test B is 0.58 N/20 mm and more; and an adhesive strength c after heating which is measured by a specific peel test C is 1.17 N/20 mm and more. |
申请公布号 |
JP2013201404(A) |
申请公布日期 |
2013.10.03 |
申请号 |
JP20120070403 |
申请日期 |
2012.03.26 |
申请人 |
TOMOEGAWA PAPER CO LTD |
发明人 |
KASUGA HIDEMASA;YAMAI ATSUSHI;MACHII SATORU |
分类号 |
H01L21/56;C09J7/02;C09J201/00;H01L23/12;H01L23/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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