| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable dicing sheet which has a predetermined adhesive strength at the time of pickup thereby to suppress scattering of semiconductor components and prevent breakage of a semiconductor component.SOLUTION: A dicing sheet comprises a base material, and an adhesive layer formed on the base material. The adhesive layer is composed of an adhesive composition including copolymer (A) including a monomer unit introduced from aromatic (meth) acrylate and at least one kind of energy ray polymerizable compound (B) selected from a cyanurate compound having a group including carbon-carbon double bands and isocyanurate compound having a group including carbon-carbon double bands. The adhesive layer has a thickness of 8-20 μm. A content of the monomer unit introduced from the aromatic (meth) acrylate is 1-20 pts.mass based on 100 pts.mass of the copolymer (A). |
