| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for sticking a wafer with which failure to pick up a chip with ultrathin thickness of 100 μm or less is prevented.SOLUTION: A pressure-sensitive adhesive tape for sticking a wafer is fabricated by forming a radiation-curable pressure-sensitive adhesive layer on a substrate surface, and is used by being stuck to a wafer with thickness of 100 μm or less, wherein the pressure-sensitive adhesive layer is formed of an energy ray-curable copolymer produced by at least partly crosslinking an acrylic copolymer as a main component, at least having a radiation-curable carbon-carbon double bond-containing group, a hydroxy group, and a carboxy group-containing group, to a main chain by using 4 to 9 pts.mass of a crosslinking agent with respect to 100 pts.mass of the acrylic copolymer, and having a gel fraction of 60% or more. |
