| 发明名称 |
STRUCTURE AND METHOD FOR COUPLING HEAT TO AN EMBEDDED THERMOELECTRIC DEVICE |
| 摘要 |
An integrated circuit with an embedded heat exchanger for coupling heat to an embedded thermoelectric device from a thermal source that is electrically isolated from a thermoelectric device. A method for forming an integrated circuit with an embedded heat exchanger.
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| 申请公布号 |
US2013255741(A1) |
申请公布日期 |
2013.10.03 |
| 申请号 |
US201313798878 |
申请日期 |
2013.03.13 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
EDWARDS HENRY L.;IRWIN RICHARD B.;CHATTERJEE TATHAGATA |
| 分类号 |
H01L35/30;H01L35/34 |
主分类号 |
H01L35/30 |
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