发明名称 |
INTEGRATED CIRCUIT STRUCTURE TO RESOLVE DEEP-WELL PLASMA CHARGING PROBLEM AND METHOD OF FORMING THE SAME |
摘要 |
During various processing operations, ions from process plasma may be transfer to a deep n-well (DNW) formed under devices structures. A reverse-biased diode may be connected to the signal line to protect a gate dielectric formed outside the DNW and is connected to the drain of the transistor formed inside the DNW.
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申请公布号 |
US2013256801(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213433194 |
申请日期 |
2012.03.28 |
申请人 |
YEN DAVID;LIN SUNG-CHIEH;HSU KUOYUAN (PETER);TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YEN DAVID;LIN SUNG-CHIEH;HSU KUOYUAN (PETER) |
分类号 |
H01L27/06;H01L21/8238 |
主分类号 |
H01L27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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